Consortio is working with an extremely well-established, international bunkering business. The company delivers high quality bunker fuels to anywhere in the world a through a carefully assembled team of experts. As a result of their continued
Hong Kong Applied Science and Technology Research Institute (ASTRI) is founded in 2000 by the Government of the Hong Kong Special Administrative Region. As Hong Kong’s largest government-funded research and development centre, ASTRI is a key
Tencent Cloud seeks a team member for its Hong Kong and Macau business to leverage local resources, internal teams, and partners to boost brand awareness and trust by creating benchmark scenarios and success stories. The role
THE HARRIS FRASER GROUP (HFG) is a wealth management company assisting clients in Asia to protect and grow their wealth since 1990. HFG employs a professional approach to wealth management by starting with a thorough knowledge
THE HARRIS FRASER GROUP (HFG) is a wealth management company assisting clients in Asia to protect and grow their wealth since 1990. HFG employs a professional approach to wealth management by starting with a thorough knowledge
THE HARRIS FRASER GROUP (HFG) is a wealth management company assisting clients in Asia to protect and grow their wealth since 1990. HFG employs a professional approach to wealth management by starting with a thorough knowledge
Its fun to work in a company where people truly BELIEVE in what theyre doing! Were committed to bringing passion and customer focus to the business. If you like wild growth and working with happy, enthusiastic
Recruit Ref: L0606866770 Posting Date: 2026-07-29 Cloud Light Technology Limited Mechanical Design Manager Its fun to work in a company where people truly BELIEVE in what theyre doing! Were committed to bringing passion and customer focus
Cloud Light Technology Limited is seeking an experienced Mechanical Design Manager to lead mechanical and packaging design for next‑generation 1.6T optical transceivers. The candidate should have strong backgrounds in high‑speed module packaging, thermal management, and COB